Patent Assignment Details
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Reel/Frame: | 013195/0620 | |
| Pages: | 4 |
| | Recorded: | 08/09/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10215691
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Filing Dt:
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08/09/2002
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Publication #:
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Pub Dt:
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10/02/2003
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Title:
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Lead free tin based solder composition
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Assignee
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1 SCHIENCE PARK ROAD |
#01-01 THE CAPRICORN |
SINGAPORE SCIENCE PART II, SINGAPORE 117528 |
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Correspondence name and address
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BEYER WEAVER & THOMAS, LLP
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QUIN C. HOELLWARTH
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P.O. BOX 778
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BERKELEY, CA 94704-0778
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