Patent Assignment Details
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| Reel/Frame: | 013233/0279 | |
| Pages: | 4 |
| | Recorded: | 08/27/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/13/2005
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Application #:
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10163082
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Filing Dt:
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06/05/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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LOW-TEMPERATURE PATTERNED WAFER BONDING WITH PHOTOSENSITIVE BENZOCYCLOBUTENE (BCB) AND 3D MEMS (MICROELECTROMECHANICAL SYSTEMS) STRUCTURE FABRICATION
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Assignee
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| 3003 SOUTH STATE STREET |
| A CONSTITUTIONAL CORPORATION OF THE STATE OF MICHIGAN |
| ANN ARBOR, MICHIGAN 48109 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE P.L.C.
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STANLEY M. ERJAVAC
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P.O. BOX 828
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BLOOMFIELD HILLS, MI 48303
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