Patent Assignment Details
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Reel/Frame: | 013237/0220 | |
| Pages: | 4 |
| | Recorded: | 08/26/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/10/2004
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Application #:
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10227341
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Filing Dt:
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08/26/2002
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Publication #:
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Pub Dt:
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02/27/2003
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Title:
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SUBSTRATE-ON-CHIP PACKAGING PROCESS
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Assignees
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CEDAR HOUSE, 41 CEDAR AVENUE |
HAMILTON HM 12, BERMUDA |
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NO. 1 R&D RD. 1 |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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DENNISON, SCHULTZ & DOUGHERTY
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DAVID E. DOUGHERTY
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612 CRYSTAL SQUARE 4
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1745 JEFFERSON DAVIS HIGHWAY
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ARLINGTON, VA 22202-3417
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