Patent Assignment Details
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| Reel/Frame: | 013238/0149 | |
| Pages: | 2 |
| | Recorded: | 08/28/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10229069
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Filing Dt:
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08/28/2002
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Publication #:
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Pub Dt:
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03/06/2003
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Title:
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Metal-less bond grinding stone, and electrolytic dressing grinding method and apparatus using the grinding stone
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Assignee
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| 2-1, HIROSAWA, WAKO-SHI, SAITAMA |
| WAKO-SHI SAITAMA, JAPAN 341-0198 |
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Correspondence name and address
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GRIFFIN & SZIPL, P.C.
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JOERG-UWE SZIPL
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2300 NINTH STREET, SOUTH
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SUITE PH-1
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ARLINGTON, VA 22204-2320
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