Patent Assignment Details
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| Reel/Frame: | 013241/0702 | |
| Pages: | 4 |
| | Recorded: | 08/28/2002 | | |
| Conveyance: | CHANGE OF ADDRESS FOR THE RECEIVING PARTY, PREVIOUSLY RECORDED ON REEL 012900 FRAME 0563 |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10144729
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Filing Dt:
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05/15/2002
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Publication #:
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Pub Dt:
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05/29/2003
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Title:
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Semiconductor device having a semiconductor chip and a lead substrate connected with each other through pads and patterned lead wires without short-circuiting the pads
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Assignee
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO 100-8310, JAPAN |
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Correspondence name and address
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BURNS, DOANE, SWECKER & MATHIS, LLP
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PLATON N. MANDROS
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P.O.BOX 1404
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ALEXANDRIA, VA 22313-1404
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