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Patent Assignment Details

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Reel/Frame:	013268/0183			Pages:	7
		Recorded:	09/06/2002
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 1

Patent #:	7057259	Issue Dt:	06/06/2006	Application #:	10101337	Filing Dt:	03/20/2002
Publication #:	US20030003608	Pub Dt:	01/02/2003
Title:	SEMICONDUCTOR WAFER WITH ID MARK, EQUIPMENT FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FROM THEM

Assignors

ARIKADO, TSUNETOSHI

Exec Dt:

08/26/2002

IWASE, MASAO

Exec Dt:

08/26/2002

NADAHARA, SOICHI

Exec Dt:

08/26/2002

UDO, YUSO

Exec Dt:

08/26/2002

USHIKU, YUKIHIRO

Exec Dt:

08/26/2002

NITTA, SHINICHI

Exec Dt:

08/26/2002

MIYASHITA, MORIYA

Exec Dt:

08/26/2002

SUGAMOTO, JUNJI

Exec Dt:

08/26/2002

YAMADA, HIROAKI

Exec Dt:

08/26/2002

NAGANO, HAJIME

Exec Dt:

08/26/2002

TANZAWA, KATSUJIRO

Exec Dt:

08/26/2002

MATSUSHITA, HIROSHI

Exec Dt:

08/26/2002

TSUCHIYA, NORIHIKO

Exec Dt:

08/26/2002

OKUMURA, KATSUYA

Exec Dt:

08/26/2002

Assignee

KABUSHIKI KAISHA TOSHIBA

1-1, SHIBAURA 1-CHOME, MINATO-KU

TOKYO, JAPAN

Correspondence name and address
	FINNEGAN, HENDERSON, FARABOW ET AL.
	ERNEST F. CHAPMAN
	1300 I STREET, N.W.
	WASHINGTON, DC 20005-3315

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