Patent Assignment Details
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| Reel/Frame: | 013274/0970 | |
| Pages: | 2 |
| | Recorded: | 09/09/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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10237083
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Filing Dt:
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09/09/2002
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Publication #:
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Pub Dt:
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03/27/2003
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Title:
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SPACER FOR MOUNTING A CHIP PACKAGE TO A SUBSTRATE
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Assignee
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| 1370, ONNA |
| ATSUGI-SHI, KANAGAWA 243-8510, JAPAN |
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Correspondence name and address
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PAVAN K. AGARWAL
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FOLEY & LARDNER
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WASHINGTON HARBOUR
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3000 K STREET, N.W., SUITE 500
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WASHINGTON, D.C. 20007-5143
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