Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013332/0731 | |
| Pages: | 2 |
| | Recorded: | 09/25/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/25/2009
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Application #:
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10253480
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Filing Dt:
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09/25/2002
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Publication #:
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Pub Dt:
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05/01/2003
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Title:
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ELECTRIC PLATING METHOD, ELECTRIC PLATING APPARATUS, PROGRAM FOR PLATING, RECORDING MEDIUM, AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE
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Assignee
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| 6, KANDA SURUGADAI 4-CHOME CHIYODA-KU |
| TOKYO, JAPAN 101-8010 |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
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MARK J. THRONSON
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ATTY. DKT.: H6810.0055/P055
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2101 L STREET NW
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WASHINGTON, DC 20037-1526
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