Patent Assignment Details
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| Reel/Frame: | 013354/0660 | |
| Pages: | 3 |
| | Recorded: | 10/04/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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10187629
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Filing Dt:
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07/03/2002
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Publication #:
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Pub Dt:
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01/23/2003
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR REINFORCING CHIP BY USE OF SEAL MEMBER AT PICKUP TIME
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Assignee
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOWN, ET AL
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MR. ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3315
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