Patent Assignment Details
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| Reel/Frame: | 013355/0390 | |
| Pages: | 2 |
| | Recorded: | 10/07/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09745541
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Filing Dt:
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12/21/2000
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Publication #:
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Pub Dt:
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06/28/2001
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Title:
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DICING CONFIGURATION FOR SEPARATING A SEMICONDUCTOR COMPONENT FROM A SEMICONDUCTOR WAFER
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Assignee
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| ST.-MARTIN-STRASSE 53 |
| PATENTABTEILUNG |
| MUENCHEN, GERMANY 81541 |
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Correspondence name and address
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LERNER AND GREENBERG
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DENISE LETTAU
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P.O. BOX 2480
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HOLLYWOOD, FL 33022
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