Patent Assignment Details
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| Reel/Frame: | 013376/0464 | |
| Pages: | 3 |
| | Recorded: | 10/10/2002 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT FIRST ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL 013096 FRAME 0480 |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/23/2004
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Application #:
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10189586
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Filing Dt:
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07/08/2002
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Publication #:
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Pub Dt:
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03/13/2003
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Title:
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RESIN MOLD SEMICONDUCTOR DEVICE
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Assignee
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| 2-3, MARUNOUCHI 2-CHOME CHIYODA-KU |
| TOKYO 100-8310, JAPAN |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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GENE Z. RUBINSON
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005
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