Patent Assignment Details
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Reel/Frame: | 013444/0217 | |
| Pages: | 3 |
| | Recorded: | 10/31/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2005
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Application #:
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10284350
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Filing Dt:
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10/31/2002
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Publication #:
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Pub Dt:
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05/06/2004
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Title:
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METAL BOND PAD FOR INTEGRATED CIRCUITS ALLOWING IMPROVED PROBING ABILITY OF SMALL PADS
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Assignee
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16215 ALTON PARWAY |
IRVINE, CALIFORNIA 92618-3616 |
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Correspondence name and address
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STERNE, KESSLER, GOLDSTEIN & ET AL
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JEFFREY T. HELVEY
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1100 NEW YORK AVE., N.W.
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SUITE 600
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WASHINGTON, D.C. 20005-3934
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05/14/2024 01:59 AM
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