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Reel/Frame:013451/0576   Pages: 3
Recorded: 10/30/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10283513
Filing Dt:
10/30/2002
Publication #:
Pub Dt:
05/08/2003
Title:
Thick film photoresist layer laminate, method of manufacturing thick film resist pattern, and method of manufacturing connecting terminal
Assignors
1
Exec Dt:
10/22/2002
2
Exec Dt:
10/22/2002
3
Exec Dt:
10/22/2002
Assignee
1
150, NAKAMARUKO, NAKAHARA-KU, KAWASAKI-SHI,
KANAGAWA-KEN, JAPAN
Correspondence name and address
CHARLES R. HOFFMANN, ESQ.
6900 JERICHO TURNPIKE
HOFFMANN & BARON, LLP
SYOSSET, NY 11791

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