Patent Assignment Details
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Reel/Frame: | 013486/0610 | |
| Pages: | 2 |
| | Recorded: | 11/06/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10289996
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Filing Dt:
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11/06/2002
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Publication #:
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Pub Dt:
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05/06/2004
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Title:
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Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
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Assignee
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NO. 6, LI-HSIN RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN ROC |
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Correspondence name and address
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MIKIO ISHIMARU
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THE LAW OFFICES OF MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD.
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SUITE A1
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SUNNYVALE, CA 94087
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