Patent Assignment Details
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Reel/Frame: | 013519/0588 | |
| Pages: | 2 |
| | Recorded: | 11/25/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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10302940
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Filing Dt:
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11/25/2002
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Publication #:
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Pub Dt:
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05/27/2004
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Title:
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METHOD FOR FABRICATING CONDUCTIVE BUMPS AND SUBSTRATE WITH METAL BUMPS FOR FLIP CHIP PACKAGING
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Assignee
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NO. 16, CREATION RD. 1 SCIENCE-BASED |
INDUSTRIAL PARK, HSIN CHU |
TAIWAN, CHINA |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH ET AL
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JOE MCKINNEY
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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