Patent Assignment Details
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| Reel/Frame: | 013590/0253 | |
| Pages: | 3 |
| | Recorded: | 12/13/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10319063
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Filing Dt:
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12/13/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Title:
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THIN HIGH-FREQUENCY MODULE HAVING INTEGRATED CIRCUIT CHIP WITH LITTLE BREAKAGE
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Assignee
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| 1-7 YUKIGAYA, OTSUKA-CHO |
| OTA-KU, TOKYO, JAPAN |
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Correspondence name and address
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BRINKS HOFER GILSON & ET AL
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P.O. BOX 10395
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CHICAGO, IL 60610
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