Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 013646/0183 | |
| Pages: | 5 |
| | Recorded: | 01/07/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10337488
|
Filing Dt:
|
01/07/2003
|
Publication #:
|
|
Pub Dt:
|
08/07/2003
| | | | |
Title:
|
Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board
|
|
Assignees
|
|
|
14-25 RYOKE 5-CHOME |
KAWAGUCHI-SHI, SAITAMA 332-8533, JAPAN |
|
|
|
2-27 OTEDORI 3-CHOME |
CHUO-KU, OSAKA-SHI, OSAKA 540-0021, JAPAN |
|
Correspondence name and address
|
|
COOPER & DUNHAM LLP
|
|
JOHN P. WHITE
|
|
1185 AVENUE OF THE AMERICA
|
|
NEW YORK, NY 10036
|
Search Results as of:
04/28/2024 10:49 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|