Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 013666/0800 | |
| Pages: | 4 |
| | Recorded: | 01/15/2003 | | |
Conveyance: | RE-RECORD TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL 013308 FRAME 0699. (ASSIGNMENT OF ASSIGNOR'S INTEREST) |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/14/2004
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Application #:
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10246445
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Filing Dt:
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09/19/2002
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Publication #:
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Pub Dt:
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09/18/2003
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Title:
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METHOD OF MAKING CHIP SCALE PACKAGE
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Assignee
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2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
TOKYO, JAPAN 100-8310 |
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Correspondence name and address
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LEYDIG VOIT & MAYER
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JEFFREY A. WYAND
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700 13TH STREET, N.W.
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SUITE 300
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WASHINGTON, DC 20005-3960
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