Patent Assignment Details
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| Reel/Frame: | 013682/0608 | |
| Pages: | 2 |
| | Recorded: | 01/21/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10118797
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Filing Dt:
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04/09/2002
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Publication #:
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Pub Dt:
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06/19/2003
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Title:
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Electroplating solution for copper thin film
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Assignees
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| 3-5-12, HIRANO-MACHI |
| CHUOU-KU, OSAKA-SHI, OSAKA, JAPAN |
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| 1-32-20, TODOROKI |
| SETAGAYA-KU, TOKYO, JAPAN |
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Correspondence name and address
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KODA & ANDROLIA
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WILLIAM L. ANDROLIA
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2029 CENTURY PARK EAST, SUITE 3850
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LOS ANGELES, CA 90067-3024
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