Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 013693/0032 | |
| Pages: | 3 |
| | Recorded: | 01/27/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10331360
|
Filing Dt:
|
12/30/2002
|
|
Publication #:
|
|
Pub Dt:
|
09/04/2003
| | | | |
|
Title:
|
CMP slurry for metal and method for manufacturing metal line contact plug of semiconductor device using the same
|
|
|
Assignee
|
|
|
|
|
| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF 467-860 |
|
|
Correspondence name and address
|
| |
MARSHALL, GERSTEIN & BORUN
|
| |
MICHAEL R. HULL
|
| |
233 S. WACKER DRIVE, SUITE 6300
|
| |
SEARS TOWER
|
| |
CHICAGO, ILLINOIS 60606-6357
|
Search Results as of:
05/09/2024 07:42 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
