Patent Assignment Details
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| Reel/Frame: | 013708/0582 | |
| Pages: | 3 |
| | Recorded: | 01/28/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10352001
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Filing Dt:
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01/28/2003
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Publication #:
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Pub Dt:
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01/22/2004
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Title:
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METHOD OF MAKING DEVICE CHIPS COLLECTIVELY FROM COMMON MATERIAL SUBSTRATE
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Assignees
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| 1-1, KAMIKODANAKA, 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| 460 OAZA KOYAMA, SUZAKA-SHI |
| NAGANO 382-8501, JAPAN |
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Correspondence name and address
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STAAS & HALSEY LLP
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H. J. STAAS
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7000 ELEVENTH STREET, N.W.
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SUITE 500
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WASHINGTON, DC 20001
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