Patent Assignment Details
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| Reel/Frame: | 013735/0362 | |
| Pages: | 3 |
| | Recorded: | 02/06/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/09/2002
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Application #:
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09354574
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Filing Dt:
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07/16/1999
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Publication #:
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Pub Dt:
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01/10/2002
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Title:
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WAFER PROCESSING APPARATUS
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Assignees
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| 6-2,OOTEMACHI 2-CHOME CHIYODA-KU, |
| TOKYO 100-0004, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY
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600 13TH ST., NW
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WASHINGTON, DC 20005
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