Patent Assignment Details
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| Reel/Frame: | 013773/0601 | |
| Pages: | 3 |
| | Recorded: | 07/02/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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10318606
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Filing Dt:
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12/11/2002
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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METHOD FOR DEPOSITING A METAL LAYER ON A SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A CAPPING LAYER
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Assignee
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| ST. MARTIN-STR. 53 |
| 81541 MUNICH, GERMANY |
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Correspondence name and address
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SIEMENS CORPORATION
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ELSA KELLER
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186 WOOD AVENUE SOUTH
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INTELLECTUAL PROP. DEPT.
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ISELIN, NJ 08830
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