Patent Assignment Details
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| Reel/Frame: | 013776/0347 | |
| Pages: | 3 |
| | Recorded: | 02/12/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/14/2006
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Application #:
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10365998
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Filing Dt:
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02/12/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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SEMICONDUCTOR SUBSTRATE FOR BUILD-UP PACKAGES
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Assignee
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| 8000 SO. FEDERAL WAY |
| BOISE, IDAHO 83716-9632 |
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Correspondence name and address
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SCHWEGMAN, LUNDBERG, WOESSNER ET AL.
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DANIEL J. KLUTH
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402
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