Patent Assignment Details
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Reel/Frame: | 013779/0276 | |
| Pages: | 4 |
| | Recorded: | 02/24/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10320983
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Filing Dt:
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12/17/2002
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Publication #:
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Pub Dt:
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05/15/2003
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Title:
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Grinding and polishing tool for diamond, method for polishing diamond, and polished diamond, single crystal diamond and single diamond compact obtained thereby
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Assignees
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3-1, KASUMIGASEKI 1-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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1-8-32 HINATAOKA |
HIRATSUKA-CITY, KANAGAWA, JAPAN 254-0905 |
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Correspondence name and address
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HOWSON AND HOWSON
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WILLIAM BAK, ESQUIRE
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SPRING HOUSE CORPORATE CENTER
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SPRING HOUSE, PA 19477
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