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Reel/Frame:013780/0009   Pages: 2
Recorded: 02/19/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/03/2004
Application #:
10367737
Filing Dt:
02/19/2003
Publication #:
Pub Dt:
08/07/2003
Title:
METHOD OF FORMING CONDUCTIVE LAYERS IN THE TRENCHES OR THROUGH HOLES MADE IN AN INSULATING FILM ON A SEMICONDUCTOR SUBSTRATE
Assignors
1
Exec Dt:
04/14/2000
2
Exec Dt:
04/14/2000
3
Exec Dt:
05/22/2000
4
Exec Dt:
04/14/2000
5
Exec Dt:
04/14/2000
6
Exec Dt:
04/14/2000
7
Exec Dt:
04/14/2000
8
Exec Dt:
04/14/2000
Assignees
1
6, KANDA SURUGADAI 4-CHOME
CHIYODA-KU, TOKYO, JAPAN
2
22-1 JOSUIHONCHO 5-CHOME
KODAIRA-SHI, TOKYO, JAPAN
Correspondence name and address
REED SMITH LLP
STANLEY P. FISHER
3110 FAIRVIEW PARK DR.
SUITE 1400
FALLS CHURCH, VA 22042

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