Patent Assignment Details
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| Reel/Frame: | 013841/0670 | |
| Pages: | 2 |
| | Recorded: | 11/01/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10275136
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Filing Dt:
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11/01/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Title:
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THICKNESS MEASURING APPARATUS, THICKNESS MEASURING METHOD, AND WET ETCHING APPARATUS AND WET ETCHING METHOD UTILIZING THEM
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Assignee
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| 1126-1, ICHINO-CHO HAMAMATSU-SHI |
| SHIZUOKA 435-8558, JAPAN |
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Correspondence name and address
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MORGAN LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVENUE NW
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WASHINGTON, DC 20004
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