Patent Assignment Details
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Reel/Frame: | 013869/0995 | |
| Pages: | 3 |
| | Recorded: | 03/07/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10383477
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Filing Dt:
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03/07/2003
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Publication #:
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Pub Dt:
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06/10/2004
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Title:
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Method and polishing pad design enabling improved wafer removal from a polishing pad in a CMP process
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Assignee
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51 MAIN AVENUE |
SACRAMENTO, CALIFORNIA 95838 |
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Correspondence name and address
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SQUIRE, SANDERS & DEMPSEY, L.L.P.
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AARON WININGER
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600 HANSEN WAY
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PALO ALTO, CA 94304-1043
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