Patent Assignment Details
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Reel/Frame: | 013903/0639 | |
| Pages: | 3 |
| | Recorded: | 03/25/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/06/2004
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Application #:
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10397065
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Filing Dt:
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03/25/2003
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Title:
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THERMAL AND MECHANICAL ATTACHMENT OF A HEATSPREADER TO A FLIP-CHIP INTEGRATED CIRCUIT STRUCTURE USING UNDERFILL
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Assignee
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1621 BARBER LANE |
MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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CONLEY ROSE, P.C.
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KEVIN L. DAFFER
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P.O. BOX 684908
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AUSTIN, TX 78768-4908
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