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Reel/Frame:013974/0893   Pages: 9
Recorded: 04/23/2003
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 112
Page 1 of 2
Pages: 1 2
1
Patent #:
5179039
Issue Dt:
01/12/1993
Application #:
07700670
Filing Dt:
05/15/1991
Title:
METHOD OF MAKING A RESIN ENCAPSULATED PIN GRID ARRAY WITH INTEGRAL HEATSINK
2
Patent #:
5216278
Issue Dt:
06/01/1993
Application #:
07841765
Filing Dt:
03/02/1992
Title:
SEMICONDUCTOR DEVICE HAVING A PAD ARRAY CARRIER PACKAGE
3
Patent #:
5289039
Issue Dt:
02/22/1994
Application #:
07912065
Filing Dt:
07/07/1992
Title:
RESIN ENCAPSULATED SEMICONDUCTOR DEVICE
4
Patent #:
5433822
Issue Dt:
07/18/1995
Application #:
07962190
Filing Dt:
12/22/1992
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH COPPER CORE BUMPS
5
Patent #:
5241133
Issue Dt:
08/31/1993
Application #:
07976720
Filing Dt:
11/16/1992
Title:
LEADLESS PAD ARRAY CHIP CARRIER
6
Patent #:
5739588
Issue Dt:
04/14/1998
Application #:
08624496
Filing Dt:
04/05/1996
Title:
SEMICONDUCTOR DEVICE
7
Patent #:
6389689
Issue Dt:
05/21/2002
Application #:
09024940
Filing Dt:
02/17/1998
Publication #:
US20010015009
Pub Dt:
08/23/2001
Title:
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
8
Patent #:
6101101
Issue Dt:
08/08/2000
Application #:
09085447
Filing Dt:
05/28/1998
Title:
UNIVERSAL LEADFRAME FOR SEMICONDUCTOR DEVICES
9
Patent #:
5973407
Issue Dt:
10/26/1999
Application #:
09120794
Filing Dt:
07/23/1998
Title:
INTEGRAL HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
10
Patent #:
5998857
Issue Dt:
12/07/1999
Application #:
09132241
Filing Dt:
08/11/1998
Title:
SEMICONDUCTOR PACKAGING STRUCTURE WITH THE BAR ON CHIP
11
Patent #:
6281568
Issue Dt:
08/28/2001
Application #:
09176614
Filing Dt:
10/21/1998
Title:
PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND LEADFRAME HAVING PARTIALLY UNDERCUT LEADS AND DIE PAD
12
Patent #:
6207562
Issue Dt:
03/27/2001
Application #:
09199041
Filing Dt:
11/24/1998
Title:
METHOD OF FORMING TITANIUM SILICIDE
13
Patent #:
6329606
Issue Dt:
12/11/2001
Application #:
09203826
Filing Dt:
12/01/1998
Title:
GRID ARRAY ASSEMBLY OF CIRCUIT BOARDS WITH SINGULATION GROOVES
14
Patent #:
6201302
Issue Dt:
03/13/2001
Application #:
09223839
Filing Dt:
12/31/1998
Title:
SEMICONDUCTOR PACKAGE HAVING MULTI-DIES
15
Patent #:
6465329
Issue Dt:
10/15/2002
Application #:
09233980
Filing Dt:
01/20/1999
Title:
MICROCIRCUIT DIE-SAWING PROTECTOR AND METHOD
16
Patent #:
6246015
Issue Dt:
06/12/2001
Application #:
09240422
Filing Dt:
01/29/1999
Title:
"PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES"
17
Patent #:
6214645
Issue Dt:
04/10/2001
Application #:
09240423
Filing Dt:
01/29/1999
Title:
METHOD OF MOLDING BALL GRID ARRAY SEMICONDUCTOR PACKAGES
18
Patent #:
6246566
Issue Dt:
06/12/2001
Application #:
09246574
Filing Dt:
02/08/1999
Title:
ELECTROSTATIC DISCHARGE PROTECTION PACKAGE AND METHOD
19
Patent #:
6296988
Issue Dt:
10/02/2001
Application #:
09262789
Filing Dt:
03/04/1999
Title:
METHOD FOR FORMING A MENTAL WIRING PATTERN ON A SEMICONDUCTOR DEVICE
20
Patent #:
6303997
Issue Dt:
10/16/2001
Application #:
09287711
Filing Dt:
04/07/1999
Title:
THIN, STACKABLE SEMICONDUCTOR PACKAGES
21
Patent #:
6268568
Issue Dt:
07/31/2001
Application #:
09305170
Filing Dt:
05/04/1999
Title:
PRINTED CIRCUIT BOARD WITH OVAL SOLDER BALL LANDS FOR BGA SEMICONDUCTOR PACKAGES
22
Patent #:
6337228
Issue Dt:
01/08/2002
Application #:
09310660
Filing Dt:
05/12/1999
Title:
LOW-COST PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE
23
Patent #:
6274927
Issue Dt:
08/14/2001
Application #:
09324710
Filing Dt:
06/03/1999
Title:
PLASTIC PACKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING
24
Patent #:
6211563
Issue Dt:
04/03/2001
Application #:
09343516
Filing Dt:
06/30/1999
Title:
SEMICONDUCTOR PACKAGE WITH AN IMPROVED LEADFRAME
25
Patent #:
6225379
Issue Dt:
05/01/2001
Application #:
09347794
Filing Dt:
07/06/1999
Title:
EPOXY RESIN COMPOSITION FOR BONDING SEMICONDUCTOR CHIPS
26
Patent #:
6228676
Issue Dt:
05/08/2001
Application #:
09348772
Filing Dt:
07/07/1999
Title:
NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
27
Patent #:
6258629
Issue Dt:
07/10/2001
Application #:
09370600
Filing Dt:
08/09/1999
Title:
METHOD OF MAKING AN ELECTRONIC DEVICE PACKAGE AND LEADFRAME
28
Patent #:
6177731
Issue Dt:
01/23/2001
Application #:
09380243
Filing Dt:
08/30/1999
Title:
SEMICONDUCTOR PACKAGE
29
Patent #:
6247229
Issue Dt:
06/19/2001
Application #:
09383022
Filing Dt:
08/25/1999
Title:
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE PACKAGE USING A PLASTIC TAPE AS A BASE
30
Patent #:
6428641
Issue Dt:
08/06/2002
Application #:
09385695
Filing Dt:
08/30/1999
Title:
METHOD FOR LAMINATING CIRCUIT PATTERN TAPE ON SEMICONDUCTOR WAFER
31
Patent #:
6448635
Issue Dt:
09/10/2002
Application #:
09385696
Filing Dt:
08/30/1999
Title:
SURFACE ACOUSTICAL WAVE FLIP CHIP
32
Patent #:
6479887
Issue Dt:
11/12/2002
Application #:
09387377
Filing Dt:
08/30/1999
Title:
CIRCUIT PATTERN TAPE FOR WAFER-SCALE PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
33
Patent #:
6437427
Issue Dt:
08/20/2002
Application #:
09391792
Filing Dt:
09/08/1999
Title:
LEAD FRAME USED FOR THE FABRICATION OF SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR PACKAGE FABRICATED USING THE SAME
34
Patent #:
6455356
Issue Dt:
09/24/2002
Application #:
09395875
Filing Dt:
09/14/1999
Title:
METHOD FOR MOLDING A LEADFRAME IN PLASTIC INTEGRATED CIRCUIT DEVICES
35
Patent #:
6426277
Issue Dt:
07/30/2002
Application #:
09421454
Filing Dt:
10/19/1999
Title:
METHODS AND A DEVICE FOR HEAT TREATMENT A SEMICONDUCTOR WAFER HAVING DIFFERENT KINDS OF IMPURITIES
36
Patent #:
6462274
Issue Dt:
10/08/2002
Application #:
09422027
Filing Dt:
10/20/1999
Title:
CHIP-SCALE SEMICONDUCTOR PACKAGE OF THE FAN-OUT TYPE AND METHOD OF MANUFACTURING SUCH PACKAGES
37
Patent #:
6489667
Issue Dt:
12/03/2002
Application #:
09422115
Filing Dt:
10/20/1999
Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
38
Patent #:
6331451
Issue Dt:
12/18/2001
Application #:
09434546
Filing Dt:
11/05/1999
Title:
METHODS OF MAKING THIN INTEGRATED CIRCUIT DEVICE PACKAGES WITH IMPROVED THERMAL PERFORMANCE AND SUBSTRATES FOR MAKING THE PACKAGES
39
Patent #:
6291884
Issue Dt:
09/18/2001
Application #:
09437013
Filing Dt:
11/09/1999
Title:
CHIP-SIZE SEMICONDUCTOR PACKAGES
40
Patent #:
6268654
Issue Dt:
07/31/2001
Application #:
09437574
Filing Dt:
11/09/1999
Title:
INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
41
Patent #:
6476478
Issue Dt:
11/05/2002
Application #:
09439917
Filing Dt:
11/12/1999
Title:
CAVITY SEMICONDUCTOR PACKAGE WITH EXPOSED LEADS AND DIE PAD AND METHOD FOR MAKING THE SAME
42
Patent #:
6415505
Issue Dt:
07/09/2002
Application #:
09440808
Filing Dt:
11/15/1999
Title:
MICROMACHINE PACKAGE FABRICATION METHOD
43
Patent #:
6309916
Issue Dt:
10/30/2001
Application #:
09441115
Filing Dt:
11/17/1999
Title:
METHOD OF MOLDING PLASTIC SEMICONDUCTOR PACKAGES
44
Patent #:
6448633
Issue Dt:
09/10/2002
Application #:
09444035
Filing Dt:
11/19/1999
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
45
Patent #:
6396043
Issue Dt:
05/28/2002
Application #:
09448538
Filing Dt:
11/22/1999
Title:
THIN IMAGE SENSOR PACKAGE FABRICATION METHOD
46
Patent #:
6319755
Issue Dt:
11/20/2001
Application #:
09452545
Filing Dt:
12/01/1999
Title:
CONDUCTIVE STRAP ATTACHMENT PROCESS THAT ALLOWS ELECTRICAL CONNECTOR BETWEEN AN INTEGRATED CIRCUITE DIE AND LEADFRAME.
47
Patent #:
6455774
Issue Dt:
09/24/2002
Application #:
09457505
Filing Dt:
12/08/1999
Title:
MOLDED IMAGE SENSOR PACKAGE
48
Patent #:
6483101
Issue Dt:
11/19/2002
Application #:
09457513
Filing Dt:
12/08/1999
Title:
MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER
49
Patent #:
6483030
Issue Dt:
11/19/2002
Application #:
09457516
Filing Dt:
12/08/1999
Title:
SNAP LID IMAGE SENSOR PACKAGE
50
Patent #:
6389687
Issue Dt:
05/21/2002
Application #:
09457517
Filing Dt:
12/08/1999
Title:
METHOD OF FABRICATING IMAGE SENSOR PACKAGES IN AN ARRAY
51
Patent #:
6266197
Issue Dt:
07/24/2001
Application #:
09458033
Filing Dt:
12/08/1999
Title:
MOLDED WINDOW ARRAY FOR IMAGE SENSOR PACKAGES
52
Patent #:
6423576
Issue Dt:
07/23/2002
Application #:
09460175
Filing Dt:
12/10/1999
Title:
A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
53
Patent #:
6369454
Issue Dt:
04/09/2002
Application #:
09461523
Filing Dt:
12/14/1999
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
54
Patent #:
6320251
Issue Dt:
11/20/2001
Application #:
09484192
Filing Dt:
01/18/2000
Title:
Stackable package for an integrated circuit
55
Patent #:
6414396
Issue Dt:
07/02/2002
Application #:
09490317
Filing Dt:
01/24/2000
Title:
PACKAGE FOR STACKED INTEGRATED CIRCUITS
56
Patent #:
6404046
Issue Dt:
06/11/2002
Application #:
09497377
Filing Dt:
02/03/2000
Title:
MODULE OF STACKED INTEGRATED CIRCUIT PACKAGES INCLUDING AN INTERPOSER
57
Patent #:
6338985
Issue Dt:
01/15/2002
Application #:
09498144
Filing Dt:
02/04/2000
Title:
Making chip size semiconductor packages
58
Patent #:
6448509
Issue Dt:
09/10/2002
Application #:
09505395
Filing Dt:
02/16/2000
Title:
PRINTED CIRCUIT BOARD WITH HEAT SPREADER AND METHOD OF MAKING
59
Patent #:
6424023
Issue Dt:
07/23/2002
Application #:
09513232
Filing Dt:
02/24/2000
Title:
LEADFRAME FOR MOLDED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
60
Patent #:
6255176
Issue Dt:
07/03/2001
Application #:
09517362
Filing Dt:
03/02/2000
Title:
Method of forming trench for semiconductor device isolation
61
Patent #:
6339004
Issue Dt:
01/15/2002
Application #:
09523372
Filing Dt:
03/10/2000
Title:
Method of forming shallow trench isolation for preventing torn oxide
62
Patent #:
6459147
Issue Dt:
10/01/2002
Application #:
09536236
Filing Dt:
03/27/2000
Title:
ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES WITH CONDUCTIVE STRAPS
63
Patent #:
6472598
Issue Dt:
10/29/2002
Application #:
09548702
Filing Dt:
04/13/2000
Title:
ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE AND METHOD
64
Patent #:
6309943
Issue Dt:
10/30/2001
Application #:
09558392
Filing Dt:
04/25/2000
Title:
Precision marking and singulation method
65
Patent #:
6441504
Issue Dt:
08/27/2002
Application #:
09558397
Filing Dt:
04/25/2000
Title:
PRECISION ALIGNED AND MARKED STRUCTURE
66
Patent #:
6372540
Issue Dt:
04/16/2002
Application #:
09561180
Filing Dt:
04/27/2000
Title:
Moisture-resistant integrated circuit chip package and method
67
Patent #:
6407458
Issue Dt:
06/18/2002
Application #:
09565586
Filing Dt:
05/04/2000
Title:
MOISTURE-RESISTANT INTEGRATED CIRCUIT CHIP PACKAGE
68
Patent #:
6429515
Issue Dt:
08/06/2002
Application #:
09565881
Filing Dt:
05/05/2000
Title:
LONG WIRE IC PACKAGE
69
Patent #:
6424031
Issue Dt:
07/23/2002
Application #:
09566680
Filing Dt:
05/08/2000
Title:
STACKABLE PACKAGE WITH HEAT SINK
70
Patent #:
6326235
Issue Dt:
12/04/2001
Application #:
09566849
Filing Dt:
05/05/2000
Title:
Lowwire ic package fabrication method
71
Patent #:
6441485
Issue Dt:
08/27/2002
Application #:
09569716
Filing Dt:
05/11/2000
Title:
APPARATUS FOR ELECTRICALLY MOUNTING AN ELECTRONIC DEVICE TO A SUBSTRATE WITHOUT SOLDERING
72
Patent #:
6501184
Issue Dt:
12/31/2002
Application #:
09574006
Filing Dt:
05/19/2000
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
73
Patent #:
6395578
Issue Dt:
05/28/2002
Application #:
09574541
Filing Dt:
05/19/2000
Title:
Semiconductor package and method for fabricating the same
74
Patent #:
6492699
Issue Dt:
12/10/2002
Application #:
09577692
Filing Dt:
05/22/2000
Title:
IMAGE SENSOR PACKAGE HAVING SEALED CAVITY OVER ACTIVE AREA
75
Patent #:
6400033
Issue Dt:
06/04/2002
Application #:
09585506
Filing Dt:
06/01/2000
Title:
REINFORCING SOLDER CONNECTIONS OF ELECTRONIC DEVICES
76
Patent #:
6339252
Issue Dt:
01/15/2002
Application #:
09593269
Filing Dt:
06/13/2000
Title:
Electronic device package and leadframe
77
Patent #:
6489651
Issue Dt:
12/03/2002
Application #:
09595851
Filing Dt:
06/16/2000
Title:
MOS TRANSISTOR THAT INHIBITS PUNCHTHROUGH
78
Patent #:
6469369
Issue Dt:
10/22/2002
Application #:
09607778
Filing Dt:
06/30/2000
Title:
LEADFRAME HAVING A MOLD INFLOW GROOVE AND METHOD FOR MAKING
79
Patent #:
6452278
Issue Dt:
09/17/2002
Application #:
09608197
Filing Dt:
06/30/2000
Title:
LOW PROFILE PACKAGE FOR PLURAL SEMICONDUCTOR DIES
80
Patent #:
6214644
Issue Dt:
04/10/2001
Application #:
09608502
Filing Dt:
06/30/2000
Title:
Flip-chip micromachine package fabrication method
81
Patent #:
6356453
Issue Dt:
03/12/2002
Application #:
09608678
Filing Dt:
06/29/2000
Title:
Electronic package having flip chip integrated circuit and passive chip component
82
Patent #:
6407381
Issue Dt:
06/18/2002
Application #:
09610314
Filing Dt:
07/05/2000
Title:
Wafer scale image sensor package
83
Patent #:
6433277
Issue Dt:
08/13/2002
Application #:
09615107
Filing Dt:
07/13/2000
Title:
PLASTIC INTERGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
84
Patent #:
6472758
Issue Dt:
10/29/2002
Application #:
09620444
Filing Dt:
07/20/2000
Title:
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES AND BOND WIRES
85
Patent #:
6424315
Issue Dt:
07/23/2002
Application #:
09631449
Filing Dt:
08/02/2000
Title:
SEMICONDUCTOR CHIP HAVING A RADIO-FREQUENCY IDENTIFICATION TRANSCEIVER
86
Patent #:
6444449
Issue Dt:
09/03/2002
Application #:
09634496
Filing Dt:
08/08/2000
Title:
D-SORBITOL DEHYDROGENASE GENE
87
Patent #:
6469258
Issue Dt:
10/22/2002
Application #:
09648946
Filing Dt:
08/23/2000
Title:
CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE
88
Patent #:
6406934
Issue Dt:
06/18/2002
Application #:
09654978
Filing Dt:
09/05/2000
Title:
WAFER LEVEL PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
89
Patent #:
6501161
Issue Dt:
12/31/2002
Application #:
09687485
Filing Dt:
10/13/2000
Title:
SEMICONDUCTOR PACKAGE HAVING INCREASED SOLDER JOINT STRENGTH
90
Patent #:
6475827
Issue Dt:
11/05/2002
Application #:
09687532
Filing Dt:
10/13/2000
Title:
METHOD FOR MAKING A SEMICONDUCTOR PACKAGE HAVING IMPROVED DEFECT TESTING AND INCREASED PRODUCTION YIELD
91
Patent #:
6340623
Issue Dt:
01/22/2002
Application #:
09693466
Filing Dt:
10/20/2000
Title:
Method of fabricating semiconductor device
92
Patent #:
6342406
Issue Dt:
01/29/2002
Application #:
09714682
Filing Dt:
11/15/2000
Title:
Flip chip on glass image sensor package fabrication method
93
Patent #:
6340846
Issue Dt:
01/22/2002
Application #:
09730721
Filing Dt:
12/06/2000
Title:
Making semiconductor packages with stacked dies and reinforced wire bonds
94
Patent #:
6448506
Issue Dt:
09/10/2002
Application #:
09752662
Filing Dt:
12/28/2000
Title:
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD FOR MAKING THE PACKAGE
95
Patent #:
6420201
Issue Dt:
07/16/2002
Application #:
09754229
Filing Dt:
01/03/2001
Title:
METHOD FOR FORMING A BOND WIRE PRESSURE SENSOR DIE PACKAGE
96
Patent #:
6432737
Issue Dt:
08/13/2002
Application #:
09754239
Filing Dt:
01/03/2001
Title:
METHOD FOR FORMING A FLIP CHIP PRESSURE SENSOR DIE PACKAGE
97
Patent #:
6441503
Issue Dt:
08/27/2002
Application #:
09754393
Filing Dt:
01/03/2001
Title:
BOND WIRE PRESSURE SENSOR DIE PACKAGE
98
Patent #:
6445075
Issue Dt:
09/03/2002
Application #:
09770859
Filing Dt:
01/26/2001
Title:
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE
99
Patent #:
6494361
Issue Dt:
12/17/2002
Application #:
09770861
Filing Dt:
01/26/2001
Title:
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD
100
Patent #:
6476331
Issue Dt:
11/05/2002
Application #:
09783797
Filing Dt:
02/14/2001
Title:
PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignors
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
04/22/2003
2
GUARDIAN ASSETS, INC.
Exec Dt:
04/22/2003
Assignee
1
CITICORP USA, INC. AS "COLLATERAL AGENT"
2 PENNS WAY
NEW CASTLE, DELAWARE 19720
Correspondence name and address
WEIL, GOTSHAL & MANGES LLP
LESTER SZETO
767 5TH AVENUE
NEW YORK, NY 10153

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