Patent Assignment Details
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| Reel/Frame: | 013990/0368 | |
| Pages: | 3 |
| | Recorded: | 04/25/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10334295
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Filing Dt:
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12/31/2002
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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CMP slurry polysilicon and method of forming semiconductor device using the same
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF 467-860 |
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Correspondence name and address
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MARSHALL, GERSTEIN & BORUN
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MICHAEL R. HULL
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233 S. WACKER DRIVE, SUITE 6300
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ATTY. DKT.: 30205/39048
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CHICAGO, IL 60606-6357
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