Patent Assignment Details
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| Reel/Frame: | 014001/0142 | |
| Pages: | 3 |
| | Recorded: | 04/29/2003 | | |
| Conveyance: | CORRECTIVE TO CORRECT THE FOURTH ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL 012807 FRAME 0678. (ASSIGNMENT OF ASSIGNOR'S INTEREST) |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10042829
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Filing Dt:
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01/08/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Title:
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APPARATUS AND METHOD OF PLACING SOLDER BALLS ONTO A SUBSTRATE
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Assignee
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| 4/F., WATSON CENTRE |
| 16 KUNG YIP ST. |
| KWAI CHUNG, HONG KONG |
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Correspondence name and address
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OSTROLENK, FABER, GERB & SOFFEN, LLP
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ROBERT C. FABER
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1180 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036-8403
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