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Patent Assignment Details
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Reel/Frame:014005/0242   Pages: 5
Recorded: 03/28/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/10/2004
Application #:
10402631
Filing Dt:
03/28/2003
Title:
FLIP-CHIP ASSEMBLY WITH THIN UNDERFILL AND THICK SOLDER MASK
Assignors
1
Exec Dt:
02/28/2003
2
Exec Dt:
02/28/2003
3
Exec Dt:
02/28/2003
4
Exec Dt:
02/28/2003
5
Exec Dt:
03/03/2003
Assignee
1
1303 E. ALGONQUIN ROAD
SCHAUMBURG, ILLINOIS 60196
Correspondence name and address
CARDINAL LAW GROUP
FRANK C. NICHOLAS
1603 ORRINGTON AVENUE
SUITE 2000
EVANSTON, IL 60201

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