Patent Assignment Details
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| Reel/Frame: | 014047/0911 | |
| Pages: | 3 |
| | Recorded: | 12/24/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10155089
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Filing Dt:
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05/28/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Title:
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METHOD OF PACKAGING ELECTRONIC COMPONENTS WITH HIGH RELIABILITY
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Assignee
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| NEC CORPORATION, 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 108-8001 |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
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STEVEN I. WIESBURD
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1177 AVENUE OF THE AMERICAS, 41ST FLOOR
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NEW YORK, NY 10036-2714
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