Patent Assignment Details
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| Reel/Frame: | 014071/0141 | |
| Pages: | 4 |
| | Recorded: | 10/23/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10433956
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Filing Dt:
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10/24/2003
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Publication #:
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Pub Dt:
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03/18/2004
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Title:
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Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg
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Assignee
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| 4-4, NISHITENMA 2-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA, JAPAN 530-8565 |
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Correspondence name and address
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CONNOLLY BOVE LODGE, ET AL.
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BURTON A. AMERNICK
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1990 M STREET, N.W.
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SUITE 800
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WASHINGTON, DC 20036-3425
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