Patent Assignment Details
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Reel/Frame: | 014075/0961 | |
| Pages: | 2 |
| | Recorded: | 10/24/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/01/2004
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Application #:
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10074718
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Filing Dt:
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02/13/2002
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Publication #:
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Pub Dt:
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08/22/2002
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Title:
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SOLDER BALL DISPOSING APPARATUS, SOLDER BALL REFLOW APPARATUS, AND SOLDER BALL BONDING APPARATUS
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Assignee
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LOCATELLIKAE 1 PAMASSUSTOREN |
AMSTERDAM, NETHERLANDS 1076 |
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Correspondence name and address
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HITACHI GLOBAL STORAGE TECHNOLOGIES
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LEWIS L. NUNNELLEY
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5600 COTTLE ROAD
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SAN JOSE, CA 95193
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