Patent Assignment Details
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| Reel/Frame: | 014117/0338 | |
| Pages: | 4 |
| | Recorded: | 05/30/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10400436
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Filing Dt:
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03/28/2003
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Publication #:
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Pub Dt:
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10/02/2003
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Title:
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Method and apparatus for forming fine circuit interconnects
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Assignees
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| 11-1, HANEDA, ASAHI-CHO |
| OHTA-KU, TOKYO, JAPAN |
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN |
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Correspondence name and address
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WENDEROTH LIND & PONACK, LLP
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MICHAEL S. HUPPERT, ESQ.
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2033 K STREET, N.W.
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SUITE 800
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WASHINGTON, DC 20006-1021
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