Patent Assignment Details
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| Reel/Frame: | 014149/0725 | |
| Pages: | 3 |
| | Recorded: | 05/29/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2004
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Application #:
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10448921
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Filing Dt:
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05/29/2003
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Publication #:
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Pub Dt:
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12/04/2003
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Title:
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CIRCUIT COMPONENT, CIRCUIT COMPONENT PACKAGE,, CIRCUIT COMPONENT BUILT-IN MODULE, CIRCUIT COMPONENT PACKAGE PRODUCTION AND CIRCUIT COMPONENT BUILT-IN MODULE PRODUCTION
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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Correspondence name and address
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MERCHANT & GOULD PC
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P.O. BOX 2903
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MINNEAPOLIS, MN 55402-0903
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