Patent Assignment Details
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| Reel/Frame: | 014164/0959 | |
| Pages: | 4 |
| | Recorded: | 06/06/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10457632
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Filing Dt:
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06/09/2003
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Title:
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SEMICONDUCTOR PACKAGE HAVING OPTIMIZED WIRE BOND POSITIONING
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Assignee
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| 1303 EAST ALGONQUIN ROAD |
| LAW DEPARTMENT |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA INC.
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7700 W. PARMER LANE
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AUSTIN, TX 78729
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