Patent Assignment Details
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| Reel/Frame: | 014176/0519 | |
| Pages: | 4 |
| | Recorded: | 06/16/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/27/2004
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Application #:
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10384829
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Filing Dt:
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03/10/2003
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Publication #:
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Pub Dt:
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09/25/2003
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Title:
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LEAD-FREE SOLDER, AND PASTE SOLDER COMPOSITION
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Assignee
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| 16-2, OAZA SAYAMAGAHARA |
| IRUMA-SHI |
| SAITAMA, JAPAN 358-8501 |
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Correspondence name and address
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KING & SCHICKLI PLLC
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WARREN D. SCHICKLI
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247 N. BROADWAY
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LEXINGTON, KY 40507
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