Patent Assignment Details
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Reel/Frame: | 014234/0186 | |
| Pages: | 2 |
| | Recorded: | 04/16/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10399268
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Filing Dt:
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04/16/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Title:
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Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board
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Assignee
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2-4, NAKANOSHIMA 3-CHOME |
KITA-KU, OSAKA-SHI, OSAKA 530-0005, JAPAN |
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Correspondence name and address
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HOGAN & HARTSON L.L.P.
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DARIUSH G. ADIL, ESQ.
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500 SOUTH GRAND AVENUE
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SUITE 1900
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LOS ANGELES, CA 90071
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