Patent Assignment Details
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| Reel/Frame: | 014265/0226 | |
| Pages: | 3 |
| | Recorded: | 06/27/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10606891
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Filing Dt:
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06/27/2003
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Publication #:
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Pub Dt:
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02/12/2004
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Title:
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STACKED LARGE-SCALE INTEGRATED CIRCUIT (LSI) SEMICONDUCTOR DEVICE WITH MINIATURIZATION AND THINNING OF PACKAGE
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Assignee
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| 6, KANDA SURUGADAI 4-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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MITCHELL W. SHAPIRO
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MILES & STOCKBRIDGE P.C.
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1751 PINNACLE DRIVE, SUITE 500
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MCLEAN, VA 22102
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