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Patent Assignment Details
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Reel/Frame:014268/0115   Pages: 28
Recorded: 06/23/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 102
Page 2 of 2
Pages: 1 2
1
Patent #:
Issue Dt:
02/08/2005
Application #:
10136710
Filing Dt:
04/30/2002
Publication #:
Pub Dt:
01/23/2003
Title:
OPEN-LOOP FOR WAVEFORM ACQUISITION
2
Patent #:
NONE
Issue Dt:
Application #:
10421059
Filing Dt:
04/23/2003
Publication #:
Pub Dt:
01/22/2004
Title:
Method for backside die thinning and polishing of packaged integrated circuits
Assignor
1
Exec Dt:
05/10/2002
Assignee
1
150 BAYTECH DRIVE
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
SKADDEN, ARPS, SLATE, MEAGHER
& FLOM, LLP
FREDERICK D. KIM
525 UNIVERSITY AVENUE, SUITE 1100
PALO ALTO, CA 94301

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