Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 014268/0115 | |
| Pages: | 28 |
| | Recorded: | 06/23/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
102
Page
2
of
2
Pages:
1 2
|
|
Patent #:
|
|
Issue Dt:
|
02/08/2005
|
Application #:
|
10136710
|
Filing Dt:
|
04/30/2002
|
Publication #:
|
|
Pub Dt:
|
01/23/2003
| | | | |
Title:
|
OPEN-LOOP FOR WAVEFORM ACQUISITION
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10421059
|
Filing Dt:
|
04/23/2003
|
Publication #:
|
|
Pub Dt:
|
01/22/2004
| | | | |
Title:
|
Method for backside die thinning and polishing of packaged integrated circuits
|
|
Assignee
|
|
|
150 BAYTECH DRIVE |
SAN JOSE, CALIFORNIA 95134 |
|
Correspondence name and address
|
|
SKADDEN, ARPS, SLATE, MEAGHER
|
|
& FLOM, LLP
|
|
FREDERICK D. KIM
|
|
525 UNIVERSITY AVENUE, SUITE 1100
|
|
PALO ALTO, CA 94301
|
Search Results as of:
05/08/2024 10:43 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|