Patent Assignment Details
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| Reel/Frame: | 014329/0849 | |
| Pages: | 3 |
| | Recorded: | 07/30/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10439589
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Filing Dt:
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05/16/2003
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Publication #:
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Pub Dt:
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12/04/2003
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Title:
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Method for filling blind via holes
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Assignees
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF. 448-8661, JAPAN |
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| 1-3, SHIBASAKI 2-CHOME |
| CHOFU-SHI, TOKYO, JAPAN |
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Correspondence name and address
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HARNESS DICKEY & PIERCE P.L.C.
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H. KEITH MILLER
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P.O. BOX 828
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BLOOMFIELD HILLS, MI 48303
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