Patent Assignment Details
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| Reel/Frame: | 014386/0797 | |
| Pages: | 5 |
| | Recorded: | 08/14/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10363640
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Filing Dt:
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08/14/2003
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Publication #:
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Pub Dt:
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01/15/2004
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Title:
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Substrate treating device and substrate treating method, substrate flattening method
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Assignees
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| 1-17-301, KIMEGAFUKURO 2-CHOME, AOBA-KU, SENDAI-SHI |
| 980-0813 MIYAGI, JAPAN |
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| 3-6, AKASAKA 6-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-8481 |
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Correspondence name and address
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FINNEGAN, HENDERSON & FARABOW, GARRETT
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MR. ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3315
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