Patent Assignment Details
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| Reel/Frame: | 014388/0490 | |
| Pages: | 4 |
| | Recorded: | 03/01/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/18/2009
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Application #:
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10721916
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Filing Dt:
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11/24/2003
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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FABRICATION METHOD FOR SEMICONDUCTOR PACKAGE HEAT SPREADERS
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Assignee
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| 5 YISHUN ST. 23 |
| SINGAPORE 768442, SINGAPORE |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD., SUITE A1
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SUNNYVALE, CA 94087
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