Patent Assignment Details
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Reel/Frame: | 014401/0167 | |
| Pages: | 3 |
| | Recorded: | 08/15/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/20/2005
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Application #:
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10641606
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Filing Dt:
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08/15/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Title:
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RESIN ENCAPSULATION MOLDING METHOD OF ELECTRONIC PART AND RESIN ENCAPSULATION MOLDING APPARATUS USED THEREFOR
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Assignee
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5, KAMITOBA KAMICHOSHI-CHO |
MINAMI-KU, KYOTO-SHI |
KYOTO, JAPAN |
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Correspondence name and address
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FASSE PATENT ATTORNEYS
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P.O. BOX 726
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HAMPDEN, MAINE 04444-0726
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