Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 014477/0472 | |
| Pages: | 3 |
| | Recorded: | 06/30/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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10433461
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Filing Dt:
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06/03/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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LEAD-FREE SOLDER ALLOY AND ELECTRONIC COMPONENTS USING IT
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Assignees
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| 3-6 NIHONBASHI NINGYO-CHO |
| 3-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-8589 |
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| 3-6, NIHONBASHI NINGYO-CHO |
| 3-CHOME, CHUO-KU |
| TOKYO 103-8589, JAPAN |
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| 8-10, MITSUYA NAKA 3-CHOME |
| YODOGAWA-KU, OSAKA-SHI, OSAKA 532-0036, JAPAN |
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Correspondence name and address
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SHERMAN & SHALLOWAY
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413 N. WASHINGTON ST.
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ALEXANDRIA, VA 22314
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