Patent Assignment Details
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| Reel/Frame: | 014478/0134 | |
| Pages: | 2 |
| | Recorded: | 06/02/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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10433314
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Filing Dt:
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06/02/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Title:
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METHOD OF HEAT TREATMENT OF SILICON WAFER DOPED WITH BORON
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Assignee
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| 25-1, SHINOMIYA 3-CHOME |
| HIRABSUKA-SHI |
| KANAGAWA, STATELESS 254-0014 |
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Correspondence name and address
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WELSH & KATZ, LTD
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GERALD T. SHEKLETON
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120 SOUTH RIVERSIDE PLAZA
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22ND FLOOR
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CHICAGO, IL 60606
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