Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 014485/0344 | |
| Pages: | 5 |
| | Recorded: | 09/12/2003 | | |
| Conveyance: | SEE RECORDING AT REEL 014527 FRAME 0110. (THIS DOCUMENT RECORDED OVER TO ADD AN OMITTED PAGE OF THE COVER SHEET LISTING THE SECOND ASSIGNEE) |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10439682
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Filing Dt:
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05/16/2003
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Publication #:
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Pub Dt:
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11/20/2003
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Title:
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Wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip
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Assignee
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| 10 KENT RIDGE CRESCENT |
| SINGAPORE, SINGAPORE 119260 |
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Correspondence name and address
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DINSMORE & SHOHL, L.L.P.
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JAMES E. BEYER
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ONE DAYTON CENTRE
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ONE SOUTH MAIN STREET, SUITE 500
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DAYTON, OHIO 45402
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